Invention Grant
- Patent Title: Tilted printed circuit board installation
- Patent Title (中): 倾斜印刷电路板安装
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Application No.: US12620361Application Date: 2009-11-17
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Publication No.: US08477508B2Publication Date: 2013-07-02
- Inventor: David A. Skirmont , Daniel K. Kilkenny
- Applicant: David A. Skirmont , Daniel K. Kilkenny
- Applicant Address: US CA San Jose
- Assignee: Brocade Communications Systems, Inc.
- Current Assignee: Brocade Communications Systems, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Bever, Hoffman & Harms, LLP
- Agent E. Eric Hoffman
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
A blade for a chassis-based system includes a printed circuit board (PCB) mounted at a tilt angle within the blade. The tilt angle provides space above or below the PCB at the front end of the blade, such that media interface modules can be flexibly positioned within the blade. A tilt angle that positions the PCB higher near the front end of the blade may enable media interface modules mounted in a belly-to-belly configuration on the PCB to be fitted within the front end of the blade. A tilt angle that positions the PCB lower near the front end of the blade may enable media interface modules mounted on the upper surface of the PCB to be fitted within the first end of the blade. The tilt angle also positions a backplane connector mounted on the PCB to properly engage a backplane when the blade is inserted into a slot.
Public/Granted literature
- US20110116245A1 Tilted Printed Circuit Board Installation Public/Granted day:2011-05-19
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