Invention Grant
- Patent Title: Fixing structure of multi-layer printed circuit board
- Patent Title (中): 多层印刷电路板的固定结构
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Application No.: US13061405Application Date: 2008-09-04
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Publication No.: US08477510B2Publication Date: 2013-07-02
- Inventor: Joonghui Lee , Sooyeup Jang , Jeonkeun Oh
- Applicant: Joonghui Lee , Sooyeup Jang , Jeonkeun Oh
- Applicant Address: KR Seoul
- Assignee: SK Innovation Co., Ltd.
- Current Assignee: SK Innovation Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: The Webb Law Firm
- International Application: PCT/KR2008/005207 WO 20080904
- International Announcement: WO2010/027111 WO 20100311
- Main IPC: H05K5/00
- IPC: H05K5/00
Abstract:
The present invention relates to a fixing structure of a raulti-layer printed circuit board, and more particularly, to a fixing structure of a multi-layer printed circuit board, which has a simple structure and a high fixing force using a printed circuit board fixing portion having slots.
Public/Granted literature
- US20110170271A1 Fixing Structure of Multi-Layer Printed Circuit Board Public/Granted day:2011-07-14
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