Invention Grant
- Patent Title: Shape measuring apparatus
- Patent Title (中): 形状测量仪
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Application No.: US12878204Application Date: 2010-09-09
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Publication No.: US08478564B2Publication Date: 2013-07-02
- Inventor: Takashi Noda , Kenji Ueda
- Applicant: Takashi Noda , Kenji Ueda
- Applicant Address: JP Kanagawa
- Assignee: Mitutoyo Corporation
- Current Assignee: Mitutoyo Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein P.L.C.
- Priority: JP2009-212734 20090915
- Main IPC: G01B5/20
- IPC: G01B5/20

Abstract:
A 3D measuring apparatus includes a probe that has a spherical gauge head for measuring a measured object; a motion mechanism that holds and moves the probe; and a motion controller that controls the motion mechanism. The controller includes a contact point obtainer that obtains a contact point location of a surface of the measured object and the gauge head based on a central location of the gauge head; a radius of the gauge head; and a swing amount of the gauge head. The controller also includes a motion commander that calculates a location command value causing the motion mechanism to move the probe, based on the contact point location obtained by the contact point obtainer.
Public/Granted literature
- US20110066400A1 SHAPE MEASURING APPARATUS Public/Granted day:2011-03-17
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