Invention Grant
- Patent Title: Automatically creating vias in a circuit design
- Patent Title (中): 在电路设计中自动创建通孔
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Application No.: US13334812Application Date: 2011-12-22
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Publication No.: US08479140B2Publication Date: 2013-07-02
- Inventor: Joseph Edward Pekarek
- Applicant: Joseph Edward Pekarek
- Applicant Address: US CA El Segundo
- Assignee: AWR Corporation
- Current Assignee: AWR Corporation
- Current Assignee Address: US CA El Segundo
- Agency: Meyertons Hood Kivlin Kowert & Goetzel, P.C.
- Agent Jeffrey C. Hood; Mark S. Williams
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Creating and detecting crossings of conductive traces on different layers of an integrated circuit or a conducting trace over a device contact in a system. Values are stored by a system simulator corresponding to a galvanic potential or same “net”. According to a set of rule based instructions vias are automatically displayed, correct-by-construction, and via connections between the traces, or the trace and device contact, to short circuit the paths. The via structure will not be created if it will short-circuit a conducting trace not associated with the net in question. By connecting traces on different layers using automatically created via structures so as not to short circuit other net traces, errors are eliminated and design cycles reduced when compared to a manual design scheme of inserting via connections. There is an interactive mode which allows the via to be easily resized by the use of familiar control handles.
Public/Granted literature
- US20120131534A1 Automatically Creating Vias in a Circuit Design Public/Granted day:2012-05-24
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