Invention Grant
- Patent Title: Process for treatment of porous substrates
- Patent Title (中): 多孔基材处理方法
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Application No.: US12883323Application Date: 2010-09-16
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Publication No.: US08479371B2Publication Date: 2013-07-09
- Inventor: Martin Gregory Hatfield
- Applicant: Martin Gregory Hatfield
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Cooper Legal Group, LLC
- Main IPC: B32B27/08
- IPC: B32B27/08

Abstract:
A process and an associated assembly for supporting a porous media during a treatment which exposes the media to a fluid that modifies at least one property of the media. The assembly includes a supporting core. The media is wrapped in a plurality of layers about the core to form a first roll of the media. The assembly includes first securement mechanisms exerting diametrical pressure on the ends of the first roll to prevent fluid flow axially out of the ends of the first roll. An additional amount of the media is being wrapped in a plurality of layers about the first roll to form a second roll of the media. The assembly includes second securement mechanisms exerting diametrical pressure on the ends of the second roll to prevent fluid flow axially out of the ends of the second roll. The assembly may be part of equipment.
Public/Granted literature
- US20120066890A1 PROCESS FOR TREATMENT OF POROUS SUBSRATES Public/Granted day:2012-03-22
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