Invention Grant
- Patent Title: Heat-dissipating assembly
- Patent Title (中): 散热组件
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Application No.: US12873270Application Date: 2010-08-31
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Publication No.: US08479805B2Publication Date: 2013-07-09
- Inventor: Shyy-Woei Chang , Kuei-Feng Chiang
- Applicant: Shyy-Woei Chang , Kuei-Feng Chiang
- Applicant Address: unknown Sinjhuang, Taipei County
- Assignee: Asia Vital Components Co., Ltd.
- Current Assignee: Asia Vital Components Co., Ltd.
- Current Assignee Address: unknown Sinjhuang, Taipei County
- Priority: TW099123950A 20100721
- Main IPC: F28F7/02
- IPC: F28F7/02

Abstract:
A heat-dissipating assembly includes a body and a bottom plate. The body has a heat-absorbing portion. The interior of the heat-absorbing portion is provided with a chamber covered by the bottom plate. The chamber has an evaporating region for generating a high pressure, and a condensing region for generating a low pressure. The pressure gradient between the evaporating region and the condensing region is used to drive the circulation of liquid/vapor phase of a working fluid. With this structure, heat can be conducted rapidly without providing any wick structure.
Public/Granted literature
- US20120018137A1 HEAT-DISSIPATING ASSEMBLY Public/Granted day:2012-01-26
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