The goal of the present invention is to provide an apparatus capable of cooperation with at least one piece of wafer processing equipment. The apparatus is connected to a first equipment via a first opening, to a wafer transport case via a second opening and to a second piece of equipment via a third opening. The apparatus is capable of removing a basket of parallel stacked trays of wafers from a wafer transport case. The apparatus is capable of placing and supporting the wafers in order to move them to the first equipment through the second opening and to the second piece of equipment through the third opening.