Invention Grant
- Patent Title: Method for RF connector grounding
- Patent Title (中): 射频连接器接地方法
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Application No.: US12966971Application Date: 2010-12-13
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Publication No.: US08480409B2Publication Date: 2013-07-09
- Inventor: Waid A. Paine , Lucian A. Brasier , James E. Lewis , Thomas H. Taylor , Lauren M. Garcia
- Applicant: Waid A. Paine , Lucian A. Brasier , James E. Lewis , Thomas H. Taylor , Lauren M. Garcia
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Christie, Parker & Hale, LLP
- Main IPC: H01R12/00
- IPC: H01R12/00
Abstract:
The present invention relates to radio frequency and microwave connectors, and more particularly to grounding methods for printed wiring board edge-launch connectors. The grounding method comprises conducting tabs secured to a PWB and to an attached connector frame holding coaxial connectors. The conducting tabs thus provide a ground connection between the connector frame and one or more ground conductors on the PWB.
Public/Granted literature
- US20120156902A1 METHOD FOR RF CONNECTOR GROUNDING Public/Granted day:2012-06-21
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