Invention Grant
- Patent Title: Method of integrally molding connector, and object connector
- Patent Title (中): 整体模制连接器和对象连接器的方法
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Application No.: US13263365Application Date: 2010-06-18
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Publication No.: US08480421B2Publication Date: 2013-07-09
- Inventor: Nobuaki Yoshioka , Ikuo Morita
- Applicant: Nobuaki Yoshioka , Ikuo Morita
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-154937 20090630
- International Application: PCT/JP2010/060394 WO 20100618
- International Announcement: WO2011/001840 WO 20110106
- Main IPC: H01R13/40
- IPC: H01R13/40

Abstract:
There is provided a method of integrally molding a connector in which the number of components can be reduced, and productivity can be enhanced.The method of integrally molding a connector according to the invention includes a first step of injection molding elastic resin 15 around a connection part 9 and an end part of a cover part 5 of an electric wire which is positioned adjacent to the connection part 9 thereby to bond the cover part 5 and the elastic resin 15 to each other, and a second step of injection molding resin 17 around the elastic resin 15 so as to compress the elastic resin 15 thereby to press-fit the elastic resin 15 to a terminal 11, and at the same time, to bond the elastic resin 15 and the resin 17 to each other.
Public/Granted literature
- US20120040571A1 METHOD OF INTEGRALLY MOLDING CONNECTOR, AND OBJECT CONNECTOR Public/Granted day:2012-02-16
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