Invention Grant
US08480421B2 Method of integrally molding connector, and object connector 有权
整体模制连接器和对象连接器的方法

  • Patent Title: Method of integrally molding connector, and object connector
  • Patent Title (中): 整体模制连接器和对象连接器的方法
  • Application No.: US13263365
    Application Date: 2010-06-18
  • Publication No.: US08480421B2
    Publication Date: 2013-07-09
  • Inventor: Nobuaki YoshiokaIkuo Morita
  • Applicant: Nobuaki YoshiokaIkuo Morita
  • Applicant Address: JP Tokyo
  • Assignee: Yazaki Corporation
  • Current Assignee: Yazaki Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2009-154937 20090630
  • International Application: PCT/JP2010/060394 WO 20100618
  • International Announcement: WO2011/001840 WO 20110106
  • Main IPC: H01R13/40
  • IPC: H01R13/40
Method of integrally molding connector, and object connector
Abstract:
There is provided a method of integrally molding a connector in which the number of components can be reduced, and productivity can be enhanced.The method of integrally molding a connector according to the invention includes a first step of injection molding elastic resin 15 around a connection part 9 and an end part of a cover part 5 of an electric wire which is positioned adjacent to the connection part 9 thereby to bond the cover part 5 and the elastic resin 15 to each other, and a second step of injection molding resin 17 around the elastic resin 15 so as to compress the elastic resin 15 thereby to press-fit the elastic resin 15 to a terminal 11, and at the same time, to bond the elastic resin 15 and the resin 17 to each other.
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