Invention Grant
- Patent Title: Connector assemblies with overmolds
- Patent Title (中): 具有包覆成型的连接器组件
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Application No.: US13106468Application Date: 2011-05-12
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Publication No.: US08480422B2Publication Date: 2013-07-09
- Inventor: Edward Siahaan , Cameron Frazier , John Ardisana , Al Golko
- Applicant: Edward Siahaan , Cameron Frazier , John Ardisana , Al Golko
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01R13/52
- IPC: H01R13/52
Abstract:
This is directed to connector assemblies for electric cables, and methods of manufacturing the same, that may include a body molded about one or more connections made between one or more conductive leads of the electric cable and one or more electrical contacts of the connector assembly. The molded body may provide support to the connections and may maintain the relative positions of the traces for functionally aligning exposed portions of the traces with other connector assemblies.
Public/Granted literature
- US20110312219A1 CONNECTOR ASSEMBLIES WITH OVERMOLDS Public/Granted day:2011-12-22
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