Invention Grant
- Patent Title: Full thickness resection device
- Patent Title (中): 全厚度切除装置
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Application No.: US13299092Application Date: 2011-11-17
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Publication No.: US08480700B2Publication Date: 2013-07-09
- Inventor: Ronald D. Adams
- Applicant: Ronald D. Adams
- Applicant Address: US MN Maple Grove
- Assignee: Boston Scientific Scimed, Inc.
- Current Assignee: Boston Scientific Scimed, Inc.
- Current Assignee Address: US MN Maple Grove
- Agency: Fay Kaplun & Marcin, LLP
- Main IPC: A61B17/32
- IPC: A61B17/32

Abstract:
A system for treating a target tissue includes (a) an instrument head sized and shaped for insertion into a hollow organ of a living body, the instrument head including a working chamber movable between an open position in which the working chamber is exposed to an exterior of the head and a closed position in which the working chamber is substantially sealed with respect to an exterior of the instrument head, the instrument head including a first imaging device having a field of view extending distally of a distal end thereof and a second imaging device having a field of view within the working chamber; (b) a handle which, during use, remains outside the living body, the handle including an actuator; (c) a steering mechanism coupled to the actuator for steering the instrument head within the hollow organ based on actuation of the actuator; and (d) a controller coupled to the first and second imaging devices for processing the image data received from the first and second imaging devices and providing images to an operator.
Public/Granted literature
- US20120065657A1 Full Thickness Resection Device Public/Granted day:2012-03-15
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