Invention Grant
US08480701B2 Device for implanting electrically isolated occlusion helixes 有权
用于植入电隔离闭塞螺旋的装置

  • Patent Title: Device for implanting electrically isolated occlusion helixes
  • Patent Title (中): 用于植入电隔离闭塞螺旋的装置
  • Application No.: US10597299
    Application Date: 2005-01-21
  • Publication No.: US08480701B2
    Publication Date: 2013-07-09
  • Inventor: Hermann Monstadt
  • Applicant: Hermann Monstadt
  • Applicant Address: DE
  • Assignee: Dendron GmbH
  • Current Assignee: Dendron GmbH
  • Current Assignee Address: DE
  • Agent Elizabeth A. O'Brien
  • Priority: DE102004003265 20040121
  • International Application: PCT/EP2005/000587 WO 20050121
  • International Announcement: WO2005/070308 WO 20050804
  • Main IPC: A61B18/04
  • IPC: A61B18/04 A61B17/08 A61F11/00 A61M29/00 A61D1/00
Device for implanting electrically isolated occlusion helixes
Abstract:
The invention relates to a device for the implantation of occlusion helixes (3) that can be separated by electrolysis in blood vessels and body cavities, especially aneurysms (12), said device comprising an insertion aid (4), at least one occlusion helix (3) that is distally arranged in relation to the insertion aid (4) and at least one electrolytically corrodible severance element (2), with at least one stabilization helix (5) being arranged between severance element (2) and occlusion helix (3) and said stabilization helix (5) being connected with the occlusion helix (3) by an electrically isolating adhesion layer (7) such that the occlusion helix (3) becomes isolated from the voltage when an electrical voltage is applied to the severance element (2). In this way, the current density in severance element (2) is further increased so that, on the one hand, shorter severance times are achieved and, on the other, the connection between the occlusion helix (3) and one of the stabilization helixes (5) used to stabilize the implant is significantly simplified compared to the known laser welding method according to prior art.
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