Invention Grant
- Patent Title: Silica and also epoxy resins
- Patent Title (中): 二氧化硅和环氧树脂
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Application No.: US12812554Application Date: 2009-02-10
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Publication No.: US08480846B2Publication Date: 2013-07-09
- Inventor: Juergen Meyer , Mario Scholz , Pia Buckel , Andreas Hille
- Applicant: Juergen Meyer , Mario Scholz , Pia Buckel , Andreas Hille
- Applicant Address: DE Essen
- Assignee: Evonik Degussa GmbH
- Current Assignee: Evonik Degussa GmbH
- Current Assignee Address: DE Essen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: DE102008000499 20080304
- International Application: PCT/EP2009/051475 WO 20090210
- International Announcement: WO2009/109442 WO 20090911
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C01B33/18 ; B32B1/00 ; C08L63/00 ; C08K3/36
Abstract:
Fumed silicon dioxide powder in the form of aggregated primary particles having a BET surface area of 175±15 m2/g and a thickening effect, based on the BET surface area, of greater than 18 mPas g/m2 is hydrophobicized with polydimethylsiloxane. This hydrophobic fumed silica has a BET surface area of 110±25 m2/g. It can be used in epoxy resins. These epoxy resins in turn can be used as adhesives.
Public/Granted literature
- US20100286311A1 SILICA AND ALSO EPOXY RESINS Public/Granted day:2010-11-11
Information query
