Invention Grant
US08481244B2 Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film
有权
含环氧聚合物，光固化树脂组合物，图案化工艺和电/电子部件保护膜
- Patent Title: Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film
- Patent Title (中): 含环氧聚合物，光固化树脂组合物，图案化工艺和电/电子部件保护膜
-
Application No.: US12889730Application Date: 2010-09-24
-
Publication No.: US08481244B2Publication Date: 2013-07-09
- Inventor: Takanobu Takeda , Hideto Kato
- Applicant: Takanobu Takeda , Hideto Kato
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2009-226214 20090930
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/40 ; G03F7/075 ; C08L83/06 ; C08L83/14 ; H01L21/312 ; C09D183/06
Abstract:
A photo-curable resin composition comprising an epoxy-containing silphenylene or silicone polymer with a Mw of 3,000-500,000 forms a coating which is useful as a protective film for electric/electronic parts.
Public/Granted literature
Information query
IPC分类:
