Invention Grant
- Patent Title: Manufacturing method of silicon spin transport device and silicon spin transport device
- Patent Title (中): 硅自旋输送装置和硅自旋输送装置的制造方法
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Application No.: US12690566Application Date: 2010-01-20
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Publication No.: US08481337B2Publication Date: 2013-07-09
- Inventor: Tomoyuki Sasaki , Tohru Oikawa , Katsumichi Tagami
- Applicant: Tomoyuki Sasaki , Tohru Oikawa , Katsumichi Tagami
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2009-042906 20090225
- Main IPC: H01L43/00
- IPC: H01L43/00

Abstract:
An object of the present invention is to provide a silicon spin transport device manufacturing method and silicon spin transport device whereby improved voltage output characteristics can be obtained. The silicon spin transport device manufacturing method comprises: a first step of patterning a silicon film by wet etching and forming a silicon channel layer; and a second step of forming a magnetization free layer and a magnetization fixed layer, which are apart from each other, on the silicon channel layer.
Public/Granted literature
- US20100213519A1 MANUFACTURING METHOD OF SILICON SPIN TRANSPORT DEVICE AND SILICON SPIN TRANSPORT DEVICE Public/Granted day:2010-08-26
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