Invention Grant
US08481344B2 Methods of evaporating metal onto a semiconductor wafer in a test wafer holder
有权
在测试晶片保持器中将金属蒸发到半导体晶片上的方法
- Patent Title: Methods of evaporating metal onto a semiconductor wafer in a test wafer holder
- Patent Title (中): 在测试晶片保持器中将金属蒸发到半导体晶片上的方法
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Application No.: US13179382Application Date: 2011-07-08
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Publication No.: US08481344B2Publication Date: 2013-07-09
- Inventor: Lam T. Luu , Shiban K. Tiku , Richard S. Bingle , Jens A. Riege , Heather L. Knoedler , Daniel C. Weaver
- Applicant: Lam T. Luu , Shiban K. Tiku , Richard S. Bingle , Jens A. Riege , Heather L. Knoedler , Daniel C. Weaver
- Applicant Address: US MA Woburn
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US MA Woburn
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01L21/687
- IPC: H01L21/687 ; C23C14/54

Abstract:
Apparatus and methods for evaporating metal onto semiconductor wafers are disclosed. One such apparatus can include an evaporation chamber that includes a wafer holder, such as a dome, and a test wafer holder that is separate and spaced apart from the wafer holder. In certain implementations, the test wafer can be coupled to a cross beam supporting at least one shaper. A metal can be evaporated onto production wafers positioned in the wafer holder while metal is evaporated on a test wafer positioned in a test wafer holder. In some instances, the production wafers can be GaAs wafers. The test wafer can be used to make a quality assessment about the production wafers.
Public/Granted literature
- US20120083118A1 METHODS OF EVAPORATING METAL ONTO A SEMICONDUCTOR WAFER IN A TEST WAFER HOLDER Public/Granted day:2012-04-05
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