Invention Grant
- Patent Title: MEMS devices
- Patent Title (中): MEMS器件
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Application No.: US12995100Application Date: 2009-05-19
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Publication No.: US08481365B2Publication Date: 2013-07-09
- Inventor: Greja J. A. M. Verhelijden , Philippe Meunier-Beillard , Johannes J. T. M. Donkers
- Applicant: Greja J. A. M. Verhelijden , Philippe Meunier-Beillard , Johannes J. T. M. Donkers
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP08104144 20080528
- International Application: PCT/IB2009/052086 WO 20090519
- International Announcement: WO2009/144619 WO 20091203
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/06
Abstract:
A method of manufacturing a MEMS device comprises forming a MEMS device element (14). A sacrificial layer (20) is provided over the device element and a package cover layer (22) is provided over the sacrificial layer. The sacrificial layer is removed using at least one opening (22) in the cover layer and the at least one opening (24) is sealed by an anneal process.
Public/Granted literature
- US20110198746A1 MEMS DEVICES Public/Granted day:2011-08-18
Information query
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