Invention Grant
- Patent Title: Method for manufacturing thin film transistor substrate
- Patent Title (中): 薄膜晶体管基板的制造方法
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Application No.: US13383220Application Date: 2010-03-16
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Publication No.: US08481373B2Publication Date: 2013-07-09
- Inventor: Tohru Okabe , Hirohiko Nishiki , Yoshimasa Chikama , Takeshi Hara
- Applicant: Tohru Okabe , Hirohiko Nishiki , Yoshimasa Chikama , Takeshi Hara
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Keating & Bennett, LLP
- Priority: JP2009-173160 20090724
- International Application: PCT/JP2010/001878 WO 20100316
- International Announcement: WO2011/010415 WO 20110127
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method for manufacturing a thin film transistor substrate includes a step of forming a gate electrode (11a) and a first interconnect on a substrate (10), a step of forming a gate insulating film (12a) having a contact hole at a position overlapping the first interconnect, a step of forming a source electrode (13a) and a drain electrode (13b) overlapping the gate electrode (11a) and separated apart from each other, and a second interconnect connected via the contact hole to the first interconnect, a step of successively forming an oxide semiconductor film (14) and a second insulating film (15), and thereafter, patterning the second insulating film (15) to form an interlayer insulating film (15a), and a step of reducing the resistance of the oxide semiconductor film (14) exposed through the interlayer insulating film (15a) to form a pixel electrode (14b).
Public/Granted literature
- US20120108018A1 METHOD FOR MANUFACTURING THIN FILM TRANSISTOR SUBSTRATE Public/Granted day:2012-05-03
Information query
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