Invention Grant
- Patent Title: Aqueous acidic formulations for copper oxide etch residue removal and prevention of copper electrodeposition
- Patent Title (中): 用于氧化铜蚀刻残渣去除和防止铜电沉积的水性酸性配方
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Application No.: US12998296Application Date: 2009-10-06
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Publication No.: US08481472B2Publication Date: 2013-07-09
- Inventor: Glenn Westwood , Seong Jin Hong , Sang In Kim
- Applicant: Glenn Westwood , Seong Jin Hong , Sang In Kim
- Applicant Address: US PA Center Valley
- Assignee: Avantor Performance Materials, Inc.
- Current Assignee: Avantor Performance Materials, Inc.
- Current Assignee Address: US PA Center Valley
- Agency: Hoffmann & Baron, LLP
- International Application: PCT/US2009/059603 WO 20091006
- International Announcement: WO2010/042457 WO 20100415
- Main IPC: C11D7/50
- IPC: C11D7/50 ; C11D11/00
Abstract:
A highly aqueous acidic cleaning composition for copper oxide etch removal from Cu-dual damascene microelectronic structures and wherein that composition prevents or substantially eliminates copper redeposition on the Cu-dual damascene microelectronic structure.
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