Invention Grant
US08481629B2 Surface mount adhesive, mounting structure including the same, and method for producing mounting structure
失效
表面贴装粘合剂，包括其的安装结构以及安装结构的制造方法
- Patent Title: Surface mount adhesive, mounting structure including the same, and method for producing mounting structure
- Patent Title (中): 表面贴装粘合剂，包括其的安装结构以及安装结构的制造方法
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Application No.: US12431303Application Date: 2009-04-28
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Publication No.: US08481629B2Publication Date: 2013-07-09
- Inventor: Ryo Kuwabara , Atsushi Yamaguchi , Hidenori Miyakawa
- Applicant: Ryo Kuwabara , Atsushi Yamaguchi , Hidenori Miyakawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-122268 20080508
- Main IPC: C04B26/06
- IPC: C04B26/06 ; C08K3/10 ; C08K3/34 ; C08J3/22 ; H05K1/02
Abstract:
A surface mount adhesive includes an epoxy resin, a curing agent, an accelerator, a first filler, and a second filler. The second filler has a specific gravity 1.1 to 3 times that of the first filler, and the second filler has a hardness higher than that of the first filler. The first filler has a largest particle size of 1 to 100 μm, and the second filler has a largest particle size of 1 to 100 μm, a specific gravity of 1.7 to 4.5, and a revised Mohs hardness of 2 to 12. The weight ratio of the first filler to the second filler is from 1:3 to 3:1, and the surface mount adhesive has a specific gravity of 1.2 to 1.5. When the surface mount adhesive is dispensed, dispensing failures are suppressed, and dispensing stability is improved.
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