Invention Grant
- Patent Title: Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element
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Application No.: US12213283Application Date: 2008-06-17
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Publication No.: US08481669B2Publication Date: 2013-07-09
- Inventor: Mikihiro Kashio
- Applicant: Mikihiro Kashio
- Applicant Address: JP Tokyo
- Assignee: Lintec Corporation
- Current Assignee: Lintec Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-171478 20070629; JP2008-51568 20080303
- Main IPC: C08G77/14
- IPC: C08G77/14

Abstract:
A molding material which can produce cured products with long-lasting excellent transparency and heat resistance, a sealing material in which the molding material is used, and a sealed optical element are provided. The molding material comprises a polysilsesquioxane compound with a ladder structure having a repeating unit of the following formula (I) in the molecule as a major component. wherein R1 represents a group shown by the formula AO—(CH2)r— (wherein A indicates a protective group for a hydroxyl group and r is an integer of 1 to 10), R2 represents a substituted or unsubstituted phenyl group, a substituted or unsubstituted (excluding substitution with OA in the above formula) alkyl group having 1 to 20 carbon atoms, or an alkenyl group having 2 to 20 carbon atoms, and l, m, and n individually represent 0 or an arbitrary integer, provided that l and n are not 0 at the same time.
Public/Granted literature
- US20090005530A1 Molding material comprising polysilsesquioxane compound, sealing material, and sealed optical element Public/Granted day:2009-01-01
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