Invention Grant
- Patent Title: Process for producing Peltier modules, and Peltier module
- Patent Title (中): 生产Peltier模块和Peltier模块的过程
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Application No.: US12224362Application Date: 2007-02-20
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Publication No.: US08481842B2Publication Date: 2013-07-09
- Inventor: Jürgen Schulz-Harder
- Applicant: Jürgen Schulz-Harder
- Applicant Address: DE Eschenbach
- Assignee: Curamik Electronics GmbH
- Current Assignee: Curamik Electronics GmbH
- Current Assignee Address: DE Eschenbach
- Agency: Welsh Flaxman & Gitler LLC
- Priority: DE102006009821 20060301; DE102006011743 20060313
- International Application: PCT/DE2007/000342 WO 20070220
- International Announcement: WO2007/098736 WO 20070907
- Main IPC: H01L35/34
- IPC: H01L35/34 ; H01L35/28 ; H01L21/00
Abstract:
The invention relates to a method for producing Peltier modules, each of which comprises several Peltier elements that are arranged between at least two substrates. The substrates are made of an electrically insulating material at least on the sides facing the Peltier elements while being provided with contact areas on said surfaces. The contact areas, to which the Peltier elements are connected by means of terminal sure during the production process, are formed by metallic areas.
Public/Granted literature
- US20090272417A1 Process for Producing Peltier Modules, and Peltier Module Public/Granted day:2009-11-05
Information query
IPC分类:
