Invention Grant
- Patent Title: Flexible wiring substrate
- Patent Title (中): 柔性布线基板
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Application No.: US12959842Application Date: 2010-12-03
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Publication No.: US08481855B2Publication Date: 2013-07-09
- Inventor: Koji Shinoda , Hiroshi Nakagawa
- Applicant: Koji Shinoda , Hiroshi Nakagawa
- Applicant Address: JP Osaka
- Assignee: Hosiden Corporation
- Current Assignee: Hosiden Corporation
- Current Assignee Address: JP Osaka
- Agency: The Webb Law Firm
- Priority: JP2009-279543 20091209
- Main IPC: H01R4/00
- IPC: H01R4/00
Abstract:
A plurality of protruding substrate portions (12) is extended from positions placed at an interval from each other along a peripheral edge of a wiring substrate (10). Each of the protruding substrate portions (12) is provided with wiring terminals (15), (16) electrically connected to each of a plurality of electrode terminals provided to an electrical instrument substrate. A cut-out part (18) is formed in a peripheral edge (13a) between the protruding substrate portions (12) in the wiring substrate (10).
Public/Granted literature
- US20110132642A1 Flexible Wiring Substrate Public/Granted day:2011-06-09
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