Invention Grant
- Patent Title: Method of preparing a flexible substrate assembly and flexible substrate assembly therefrom
- Patent Title (中): 从其制备柔性基底组件和柔性基底组件的方法
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Application No.: US13118225Application Date: 2011-05-27
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Publication No.: US08481859B2Publication Date: 2013-07-09
- Inventor: Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
- Applicant: Jesmin Haq , Scott Ageno , Douglas E. Loy , Shawn O'Rourke , Robert Naujokaitis
- Applicant Address: US AZ Scottsdale
- Assignee: Arizona Board of Regents, a body corporate of the State of Arizona, Acting for and on behalf of Arizona State University
- Current Assignee: Arizona Board of Regents, a body corporate of the State of Arizona, Acting for and on behalf of Arizona State University
- Current Assignee Address: US AZ Scottsdale
- Agency: Bryan Cave LLP
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
Some embodiments teach a method of preparing a flexible substrate assembly. The method can include: (a) providing a carrier substrate; (b) providing a cross-linking adhesive; (c) providing a plastic substrate; and (d) coupling the carrier substrate to the plastic substrate using the cross-linking adhesive. Other embodiments are disclosed in this application.
Public/Granted literature
- US20110228492A1 METHOD OF PREPARING A FLEXIBLE SUBSTRATE ASSEMBLY AND FLEXIBLE SUBSTRATE ASSEMBLY THEREFROM Public/Granted day:2011-09-22
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