Invention Grant
- Patent Title: Method of attaching die to circuit board with an intermediate interposer
- Patent Title (中): 将电路板与中间插入件连接的方法
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Application No.: US13156536Application Date: 2011-06-09
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Publication No.: US08481861B2Publication Date: 2013-07-09
- Inventor: Robert C. Cooney , Joseph M. Wilkinson
- Applicant: Robert C. Cooney , Joseph M. Wilkinson
- Applicant Address: US IL Rockford
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US IL Rockford
- Agency: Carlson, Gaskey & Olds P.C.
- Main IPC: H05K1/09
- IPC: H05K1/09
Abstract:
A die having a base formed of a first material is connected to a board having a base formed of a second material. An interposer having a coefficient of thermal expansion intermediate coefficients of thermal expansion of the first and second materials is positioned between the die and the board.
Public/Granted literature
- US20110232952A1 METHOD OF ATTACHING DIE TO CIRCUIT BOARD WITH AN INTERMEDIATE INTERPOSER Public/Granted day:2011-09-29
Information query
