Invention Grant
- Patent Title: Substrate and method for manufacturing the same
- Patent Title (中): 基材及其制造方法
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Application No.: US12061203Application Date: 2008-04-02
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Publication No.: US08481863B2Publication Date: 2013-07-09
- Inventor: Akinori Shiraishi , Kei Murayama , Masahiro Sunohara , Naoyuki Koizumi , Mitsutoshi Higashi
- Applicant: Akinori Shiraishi , Kei Murayama , Masahiro Sunohara , Naoyuki Koizumi , Mitsutoshi Higashi
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2007-097614 20070403
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/11 ; H01K3/10

Abstract:
A substrate includes a storage portion which is defined by a base for mounting a light emitting element and a wall portion standing up on and from the base. A package is structured such that the upper end of the wall portion so formed as to surround the periphery of the storage portion is connected to a cover to thereby seal a light emitting element. A seal structure is composed of an uneven portion formed on the lower surface side surface of the base, a close contact layer formed on the surface of the uneven portion, a power supply layer formed on the close contact layer, and an electrode layer formed on the surface of the power supply layer. The uneven portion includes a first recessed portion formed at a position spaced in the radial direction from the outer periphery of a through electrode or from the inner wall of a through hole, and a second recessed portion formed at a position spaced further outwardly from the first recessed portion.
Public/Granted literature
- US20080251287A1 SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2008-10-16
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