Invention Grant
- Patent Title: Conductive grounding pad
- Patent Title (中): 导电接地垫
-
Application No.: US13186562Application Date: 2011-07-20
-
Publication No.: US08481867B2Publication Date: 2013-07-09
- Inventor: Alf Martin Book
- Applicant: Alf Martin Book
- Applicant Address: SE Kungalv
- Assignee: Brady Converting AB
- Current Assignee: Brady Converting AB
- Current Assignee Address: SE Kungalv
- Agency: Whyte Hirschboeck Dudek S.C.
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
Compressible grounding pads with two conductor layers separated by a compressible foam layer comprise: (A) A first conductor layer, e.g., copper foil; (B) A first adhesive layer in direct contact with a part of the first conductor layer, the first conductor layer extending beyond the first adhesive layer; (C) A foam layer in direct contact with one facial side of the first adhesive layer; (D) A second adhesive layer in direct contact with the opposite facial side of foam layer; (E) A second conductor layer, e.g., copper foil, in direct contact with the second adhesive layer, the second conductor layer extending beyond the second adhesive layer such that the second conductor layer joins with the first conductor layer; (F) An electrically conductive third adhesive layer in direct contact with the facial surface opposite the facial surface that is in direct contact with the second conductor layer; and (G) An optional release liner in direct contact with the third adhesive layer.
Public/Granted literature
- US20120018211A1 Conductive Grounding Pad Public/Granted day:2012-01-26
Information query