Invention Grant
- Patent Title: Keypad assembly and electronic device using the same
- Patent Title (中): 键盘组装和电子设备使用相同
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Application No.: US12944924Application Date: 2010-11-12
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Publication No.: US08481879B2Publication Date: 2013-07-09
- Inventor: Bin Dai
- Applicant: Bin Dai
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010251934 20100812
- Main IPC: H01H13/12
- IPC: H01H13/12
Abstract:
A keypad assembly includes a keycap, fixing bracket, and a fixing member. The fixing member fixes the keypad to the fixing bracket. The fixing bracket includes two support portions, a fixing portion, and at least two resilient portions. The resilient portions interconnect the support portions and the fixing portions. The keycap fixes on the fixing portion. The resilient portions are capable of elastically deforming and generate elastic restoring force to the keycap.
Public/Granted literature
- US20120037482A1 KEYPAD ASSEMBLY AND ELECTRONIC DEVICE USING THE SAME Public/Granted day:2012-02-16
Information query
