Invention Grant
- Patent Title: Method for machining tapered micro holes
- Patent Title (中): 锥形微孔加工方法
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Application No.: US12111594Application Date: 2008-04-29
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Publication No.: US08481887B2Publication Date: 2013-07-09
- Inventor: Mehmet E. Alpay , Jeffrey Howerton , Michael Nashner , Ling Wen
- Applicant: Mehmet E. Alpay , Jeffrey Howerton , Michael Nashner , Ling Wen
- Applicant Address: US OR Portland
- Assignee: Electro Scientific Industries, Inc.
- Current Assignee: Electro Scientific Industries, Inc.
- Current Assignee Address: US OR Portland
- Agency: Young Basile
- Main IPC: B23K26/08
- IPC: B23K26/08 ; B23K26/38 ; H01L21/52
Abstract:
A method for laser machining through micro-holes having desired geometric cross-section requirements in a thin, substantially homogenous material.
Public/Granted literature
- US20080272095A1 METHOD FOR MACHINING TAPERED MICRO HOLES Public/Granted day:2008-11-06
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