Invention Grant
US08481896B2 Heater plate with embedded hyper-conductive thermal diffusion layer for increased temperature rating and uniformity
有权
加热板采用嵌入式超导热扩散层，提高了温度等级和均匀性
- Patent Title: Heater plate with embedded hyper-conductive thermal diffusion layer for increased temperature rating and uniformity
- Patent Title (中): 加热板采用嵌入式超导热扩散层，提高了温度等级和均匀性
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Application No.: US12881790Application Date: 2010-09-14
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Publication No.: US08481896B2Publication Date: 2013-07-09
- Inventor: Phillip G. Quinton, Jr.
- Applicant: Phillip G. Quinton, Jr.
- Agency: Schneck & Schneck
- Agent Thomas Schneck; Mark Protsik
- Main IPC: H05B3/06
- IPC: H05B3/06 ; H05B3/68 ; F28F7/00
Abstract:
A heater plate is constructed with an embedded thermal diffusion layer of pyrolytic graphite to provide increased temperature uniformity in a critical heating surface. The heater has first and second metal plates with a heater element contained within the first plate and a core of the pyrolytic graphite diffusion layer sandwiched between the heater element and the second metal plate. The diffusion layer may be sputter metal coated to improve bonding of the layer to the plates.
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