Invention Grant
- Patent Title: Printed circuit board or card comprising a heating wire
- Patent Title (中): 印刷电路板或包含加热线的卡
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Application No.: US11814393Application Date: 2006-01-24
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Publication No.: US08481897B2Publication Date: 2013-07-09
- Inventor: Markus Wöelfel
- Applicant: Markus Wöelfel
- Applicant Address: DE
- Assignee: Jumatech, GmbH
- Current Assignee: Jumatech, GmbH
- Current Assignee Address: DE
- Agency: Cantor Colburn LLP
- Priority: DE202005001163U 20050124
- International Application: PCT/EP2006/000614 WO 20060124
- International Announcement: WO2006/077165 WO 20060727
- Main IPC: H05B3/16
- IPC: H05B3/16 ; H05B3/22 ; H05K1/00 ; H05K1/18
Abstract:
A printed circuit board or card (1) has an electric circuit (1a) and at least one electrically insulated conductive heating wire (2), the heating wire (2) being wire-printed on or in the printed circuit board or card. Heating wire (2) can be connected at connection points (4) to a voltage source (not shown) to be provided on or in the printed circuit board or card (1).
Public/Granted literature
- US20080105670A1 Printed Circuit Board or Card Comprising a Heating Wire Public/Granted day:2008-05-08
Information query
