Invention Grant
US08482002B2 Semiconductor device including bonding pads and semiconductor package including the semiconductor device
有权
包括接合焊盘和包括半导体器件的半导体封装的半导体器件
- Patent Title: Semiconductor device including bonding pads and semiconductor package including the semiconductor device
- Patent Title (中): 包括接合焊盘和包括半导体器件的半导体封装的半导体器件
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Application No.: US12591203Application Date: 2009-11-12
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Publication No.: US08482002B2Publication Date: 2013-07-09
- Inventor: Chear-yeon Mun
- Applicant: Chear-yeon Mun
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2009-0004574 20090120
- Main IPC: H01L23/58
- IPC: H01L23/58
Abstract:
Provided is a semiconductor device that may prevent a test pad planned not to be wire bonded from being wire bonded. The semiconductor device may include a bonding pad planned to be wire bonded and a test pad planned not to be wire bonded, and a passivation layer including a first opening portion exposing part of the bonding pad and a second opening portion exposing part of the test pad, wherein the diameter of the first opening portion is greater than the diameter of a tip of a bonding wire, and the diameter of the second opening portion is less than the diameter of the tip of the bonding wire.
Public/Granted literature
- US20100181567A1 Semiconductor device including bonding pads and semiconductor package including the semiconductor device Public/Granted day:2010-07-22
Information query
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