Invention Grant
- Patent Title: Mother substrate, array substrate and method for manufacturing the same
- Patent Title (中): 母基板,阵列基板及其制造方法
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Application No.: US13160700Application Date: 2011-06-15
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Publication No.: US08482006B2Publication Date: 2013-07-09
- Inventor: Huafeng Liu , Hongxi Xiao , Shunkang Su , Ping Wu , Hanting Ding
- Applicant: Huafeng Liu , Hongxi Xiao , Shunkang Su , Ping Wu , Hanting Ding
- Applicant Address: CN Beijing
- Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
- Current Assignee: Beijing Boe Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201010211521 20100621
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L31/036 ; H01L31/0376 ; H01L31/20

Abstract:
The present invention relates to a mother substrate and a method for manufacturing the same, the mother substrate comprising: a substrate, comprising at least one display region and pre-cutting regions in a periphery of the display region, wherein the display region comprises gate scanning lines and data scanning lines, the pre-cutting regions comprise a gate-line connecting line and a data-line connecting line electrically connected to each other, and the gate-line connecting line is electrically connected to all of the gate scanning lines in the display region, and the data-line connecting line is electrically connected to all of the data scanning lines in the display region substrate.
Public/Granted literature
- US20110309380A1 MOTHER SUBSTRATE, ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-12-22
Information query
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