Invention Grant
- Patent Title: Epitaxial wafer for light emitting diode
- Patent Title (中): 用于发光二极管的外延晶片
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Application No.: US13255166Application Date: 2010-02-24
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Publication No.: US08482027B2Publication Date: 2013-07-09
- Inventor: Noriyoshi Seo , Atsushi Matsumura , Ryouichi Takeuchi
- Applicant: Noriyoshi Seo , Atsushi Matsumura , Ryouichi Takeuchi
- Applicant Address: JP Tokyo
- Assignee: Showa Denko K.K.
- Current Assignee: Showa Denko K.K.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-056779 20090310
- International Application: PCT/JP2010/001246 WO 20100224
- International Announcement: WO2010/103737 WO 20100916
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L21/00

Abstract:
An epitaxial wafer for a light emitting diode, including a GaAs substrate, a light emitting unit provided on the GaAs substrate, and a strain adjustment layer provided on the light emitting unit, wherein the light emitting unit has a strained light emitting layer having a composition formula of (AlXGa1-X)YIn1-YP (wherein X and Y are numerical values that satisfy 0≦X≦0.1 and 0.39≦Y≦0.45 respectively), and the strain adjustment layer is transparent to the emission wavelength and has a lattice constant that is smaller than the lattice constant of the GaAs substrate. The invention provides an epitaxial wafer that enables mass production of a high-output and/or high-efficiency LED having an emission wavelength of not less than 655 nm.
Public/Granted literature
- US20110316020A1 EPITAXIAL WAFER FOR LIGHT EMITTING DIODE Public/Granted day:2011-12-29
Information query
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