Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13424340Application Date: 2012-03-19
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Publication No.: US08482028B2Publication Date: 2013-07-09
- Inventor: Wataru Saito , Syotaro Ono , Toshiyuki Naka , Shunji Taniuchi , Miho Watanabe , Hiroaki Yamashita
- Applicant: Wataru Saito , Syotaro Ono , Toshiyuki Naka , Shunji Taniuchi , Miho Watanabe , Hiroaki Yamashita
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Patterson & Sheridan, LLP
- Priority: JP2011-064668 20110323
- Main IPC: H01L29/772
- IPC: H01L29/772 ; H01L21/335

Abstract:
According to one embodiment, a semiconductor device includes a first semiconductor layer of a first conductive type, and a periodic array structure having a second semiconductor layer of a first conductive type and a third semiconductor layer of a second conductive type periodically arrayed on the first semiconductor layer in a direction parallel with a major surface of the first semiconductor layer. The second semiconductor layer and the third semiconductor layer are disposed in dots on the first semiconductor layer. A periodic structure in the outermost peripheral portion of the periodic array structure is different from a periodic structure of the periodic array structure in a portion other than the outermost peripheral portion.
Public/Granted literature
- US20120241847A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-09-27
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