Invention Grant
- Patent Title: Semiconductor device and integrated circuit including the semiconductor device
- Patent Title (中): 包括半导体器件的半导体器件和集成电路
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Application No.: US13117908Application Date: 2011-05-27
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Publication No.: US08482029B2Publication Date: 2013-07-09
- Inventor: Anton Mauder , Franz Hirler , Joachim Weyers
- Applicant: Anton Mauder , Franz Hirler , Joachim Weyers
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device includes a source metallization and a semiconductor body. The semiconductor body includes a first field-effect structure including a source region of a first conductivity type electrically coupled to the source metallization. The semiconductor body also includes a second field-effect structure including a source region of the first conductivity type electrically coupled to the source metallization. A voltage tap including a semiconductor region within the semiconductor body is electrically coupled to a first gate electrode of the first field-effect structure by an intermediate inverter structure.
Public/Granted literature
- US20120299053A1 Semiconductor Device and Integrated Circuit Including the Semiconductor Device Public/Granted day:2012-11-29
Information query
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