Invention Grant
- Patent Title: Lateral high electron mobility transistor
- Patent Title (中): 侧向高电子迁移率晶体管
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Application No.: US13090350Application Date: 2011-04-20
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Publication No.: US08482036B2Publication Date: 2013-07-09
- Inventor: Markus Zundel , Franz Hirler
- Applicant: Markus Zundel , Franz Hirler
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/778
- IPC: H01L29/778

Abstract:
A lateral HEMT includes a substrate, a first semiconductor layer above the substrate and a second semiconductor layer on the first semiconductor layer. The lateral HEMT further includes a gate electrode, a source electrode, a drain electrode and a rectifying Schottky junction. A first terminal of the rectifying Schottky junction is electrically coupled to the source electrode and a second terminal of the rectifying Schottky junction is electrically coupled to the second semiconductor layer.
Public/Granted literature
- US20120267636A1 Lateral High Electron Mobility Transistor Public/Granted day:2012-10-25
Information query
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