Invention Grant
- Patent Title: DRAM layout with vertical FETS and method of formation
- Patent Title (中): DRAM布局采用垂直FETS和形成方法
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Application No.: US13608190Application Date: 2012-09-10
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Publication No.: US08482047B2Publication Date: 2013-07-09
- Inventor: Todd R. Abbott , Homer M. Manning
- Applicant: Todd R. Abbott , Homer M. Manning
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John, P.S.
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
DRAM cell arrays having a cell area of about 4F2 comprise an array of vertical transistors with buried bit lines and vertical double gate electrodes. The buried bit lines comprise a silicide material and are provided below a surface of the substrate. The word lines are optionally formed of a silicide material and form the gate electrode of the vertical transistors. The vertical transistor may comprise sequentially formed doped polysilicon layers or doped epitaxial layers. At least one of the buried bit lines is orthogonal to at least one of the vertical gate electrodes of the vertical transistors.
Public/Granted literature
- US20130001663A1 DRAM Layout with Vertical FETS and Method of Formation Public/Granted day:2013-01-03
Information query
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