Invention Grant
- Patent Title: Semiconductor structure and manufacturing method for the same
- Patent Title (中): 半导体结构及制造方法相同
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Application No.: US13101486Application Date: 2011-05-05
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Publication No.: US08482059B2Publication Date: 2013-07-09
- Inventor: Chen-Yuan Lin , Cheng-Chi Lin , Shih-Chin Lien , Shyi-Yuan Wu
- Applicant: Chen-Yuan Lin , Cheng-Chi Lin , Shih-Chin Lien , Shyi-Yuan Wu
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A semiconductor structure and a manufacturing method for the same are provided. The semiconductor structure includes a first doped well, a first doped electrode, a second doped electrode, doped strips and a doped top region. The doped strips are on the first doped well between the first doped electrode and the second doped electrode. The doped strips are separated from each other. The doped top region is on the doped strips and extended on the first doped well between the doped strips. The first doped well and the doped top region have a first conductivity type. The doped strips have a second conductivity type opposite to the first conductivity type.
Public/Granted literature
- US20120280316A1 Semiconductor Structure and Manufacturing Method for the Same Public/Granted day:2012-11-08
Information query
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