Conductive compositions and processes for use in the manufacture of semiconductor devices

Invention Grant

US08482089B2 Conductive compositions and processes for use in the manufacture of semiconductor devices—organic medium components 有权

Title translation: 用于制造半导体器件的导电组合物和方法 - 有机介质组分

Patent Title: Conductive compositions and processes for use in the manufacture of semiconductor devices—organic medium components
Patent Title (中): 用于制造半导体器件的导电组合物和方法 - 有机介质组分
Application No.: US13446619

Application Date: 2012-04-13
Publication No.: US08482089B2

Publication Date: 2013-07-09
Inventor: Hideki Akimoto , Takuya Konno , Giovanna Laudisio , Patricia J. Ollivier , Michael Rose , Jerome David Smith , Richard John Sheffield Young
Applicant: Hideki Akimoto , Takuya Konno , Giovanna Laudisio , Patricia J. Ollivier , Michael Rose , Jerome David Smith , Richard John Sheffield Young
Applicant Address: US DE Wilmington
Assignee: E I du Pont de Nemours and Company
Current Assignee: E I du Pont de Nemours and Company
Current Assignee Address: US DE Wilmington
Main IPC: H01L31/04
IPC: H01L31/04 ; H01L21/768

Abstract:

Embodiments of the invention relate to a silicon semiconductor device, and a conductive paste for use in the front side of a solar cell device.

Abstract(Chinese):

本发明的实施例涉及一种硅半导体器件和用于太阳能电池器件前侧的导电膏。

Public/Granted literature

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L31/00	对红外辐射、光、较短波长的电磁辐射，或微粒辐射敏感的，并且专门适用于把这样的辐射能转换为电能的，或者专门适用于通过这样的辐射进行电能控制的半导体器件；专门适用于制造或处理这些半导体器件或其部件的方法或设备；其零部件（H01L51/42优先；由形成在一共用衬底内或其上的多个固态组件，而不是辐射敏感元件与一个或多个电光源的结合所组成的器件入H01L27/00）
H01L31/04	.用作光伏〔PV〕转换器件（制造中其测试入H01L21/66；制造之后其测试入H02S50/10）