Invention Grant
- Patent Title: Semiconductor photodetector and manufacturing method therefor
- Patent Title (中): 半导体光电探测器及其制造方法
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Application No.: US12038247Application Date: 2008-02-27
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Publication No.: US08482096B2Publication Date: 2013-07-09
- Inventor: Matobu Kikuchi , Yasuo Nakajima , Yoshiyuki Nakashima , Hitoshi Sakuma
- Applicant: Matobu Kikuchi , Yasuo Nakajima , Yoshiyuki Nakashima , Hitoshi Sakuma
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2007-241061 20070918
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
A method for manufacturing a semiconductor photodetector includes: forming an insulating film on a semiconductor substrate; forming an electrode on and in contact with a predetermined area of a surface of the semiconductor substrate; forming a resist on the insulating film after forming the electrode; forming a power supply layer of a metal on the resist and the electrode; plating a surface of a portion of the power supply layer with a metal coating, after forming the power supply layer, the portion overlying and being in contact with the electrode; after the plating, etching and removing a part of the power supply layer leaving a portion that is covered with the metal coating and is an extension of the electrode; and removing the resist after etching the power supply layer.
Public/Granted literature
- US20090072338A1 SEMICONDUCTOR PHOTODETECTOR AND MANUFACTURING METHOD THEREFOR Public/Granted day:2009-03-19
Information query
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