Invention Grant
- Patent Title: Circular shield of a circuit-substrate laminated module and electronic apparatus
- Patent Title (中): 电路基板层叠模块和电子设备的圆形屏蔽
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Application No.: US12926288Application Date: 2010-11-08
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Publication No.: US08482107B2Publication Date: 2013-07-09
- Inventor: Shinji Rokuhara , Shuichi Oka , Katsuji Matsumoto , Shusaku Yanagawa
- Applicant: Shinji Rokuhara , Shuichi Oka , Katsuji Matsumoto , Shusaku Yanagawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2009-296070 20091225
- Main IPC: H01L23/552
- IPC: H01L23/552
Abstract:
A device that comprises a plurality of circuit elements on a substrate; a shielding element between at least two of the plurality of circuit elements; and a bonding element that electrically connects the shielding element to a grounding circuit of a semiconductor chip that is on the substrate.
Public/Granted literature
- US20110156224A1 Circuit-substrate laminated module and electronic apparatus Public/Granted day:2011-06-30
Information query
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