Invention Grant
- Patent Title: Integrated circuit packaging system with dual connection and method of manufacture thereof
- Patent Title (中): 具有双重连接的集成电路封装系统及其制造方法
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Application No.: US13241141Application Date: 2011-09-22
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Publication No.: US08482109B2Publication Date: 2013-07-09
- Inventor: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu
- Applicant: Zigmund Ramirez Camacho , Henry Descalzo Bathan , Emmanuel Espiritu
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent I-Chang John Yang
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral contact layer surrounding the peripheral lead with a non-horizontal side exposed from the peripheral contact layer; forming an inner lead and a paddle non-planar with the peripheral lead; mounting an integrated circuit to the paddle; and forming an encapsulation covering the integrated circuit and exposing the inner lead, the paddle, and the non-horizontal side.
Public/Granted literature
- US20130075883A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL CONNECTION AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-03-28
Information query
IPC分类:
