A package substrate has wires that electrically connect to a semiconductor chip, and surface side terminals that are solid and cylindrical and ends of which are electrically connected to the wires. The semiconductor chip is sealed by a sealing resin layer that is formed by molding a sealing resin so as to cover the semiconductor chip. A surface of the sealing resin layer is made to have a height that is the same as that of end surfaces of other ends of the surface side terminals by grinding. Thus, the surface of the sealing resin layer is a ground surface that is a rough surface and is formed by grinding. The end surfaces of the surface side terminals are exposed at the ground surface of the sealing resin layer.