Invention Grant
- Patent Title: Integrated circuit micro-module
- Patent Title (中): 集成电路微模块
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Application No.: US13467259Application Date: 2012-05-09
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Publication No.: US08482118B2Publication Date: 2013-07-09
- Inventor: Anuraag Mohan , Peter Smeys
- Applicant: Anuraag Mohan , Peter Smeys
- Applicant Address: US CA Santa Clara
- Assignee: National Semiconductor Corporation
- Current Assignee: National Semiconductor Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/12 ; H01L23/053 ; H01L23/34
Abstract:
One aspect of the present invention relates to an integrated circuit package that includes multiple layers of a planarizing, photo-imageable epoxy that are formed over a substrate. In some designs, the substrate is a silicon wafer. An integrated circuit is embedded in the epoxy. An antenna, which is electrically coupled to the active face of the integrated circuit through an interconnect layer, is formed over one of the epoxy layers. In various embodiments, at least some of the epoxy layers are positioned between the substrate and the antenna such that there is a distance of at least approximately 100 microns between the substrate and the antenna.
Public/Granted literature
- US20120217625A1 INTEGRATED CIRCUIT MICRO-MODULE Public/Granted day:2012-08-30
Information query
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