Invention Grant
- Patent Title: Semiconductor chip assembly
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Application No.: US12213754Application Date: 2008-06-24
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Publication No.: US08482119B2Publication Date: 2013-07-09
- Inventor: Fong Lim , See Yau Lee , Yang Hong Heng
- Applicant: Fong Lim , See Yau Lee , Yang Hong Heng
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34
Abstract:
A semiconductor chip assembly includes a semiconductor chip and a pyrolytic graphite element that is an electrode that is electrically connected to and provides electrical conduction of current from the chip during operation of the chip.
Public/Granted literature
- US20090315172A1 Semiconductor chip assembly Public/Granted day:2009-12-24
Information query
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