Invention Grant
US08482122B2 Conductive pad structure, chip package structure and device substrate
失效
导电垫结构，芯片封装结构和器件基板
- Patent Title: Conductive pad structure, chip package structure and device substrate
- Patent Title (中): 导电垫结构，芯片封装结构和器件基板
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Application No.: US13071515Application Date: 2011-03-25
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Publication No.: US08482122B2Publication Date: 2013-07-09
- Inventor: Yen-Chieh Lin
- Applicant: Yen-Chieh Lin
- Applicant Address: TW Taoyuan
- Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee: Chunghwa Picture Tubes, Ltd.
- Current Assignee Address: TW Taoyuan
- Agency: Jianq Chyun IP Office
- Priority: TW99224056U 20101210
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A conductive pad structure, configured in a peripheral circuit area of a device substrate, is provided. The conductive pad structure includes a conductive pad and a plurality of conductive spacers. The conductive spacers are configured on the conductive pad and arranged as a non-closed pattern on the conductive pad. Besides, a chip package structure and a device substrate that both have the above-mentioned conductive pad structure are also provided.
Public/Granted literature
- US20120146217A1 CONDUCTIVE PAD STRUCTURE, CHIP PACKAGE STRUCTURE AND DEVICE SUBSTRATE Public/Granted day:2012-06-14
Information query
IPC分类:
