Invention Grant
- Patent Title: Via structure
- Patent Title (中): 通过结构
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Application No.: US13194986Application Date: 2011-07-31
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Publication No.: US08482131B2Publication Date: 2013-07-09
- Inventor: Philip J. Ireland
- Applicant: Philip J. Ireland
- Applicant Address: TW Kueishan, Tao-Yuan Hsien
- Assignee: Nanya Technology Corp.
- Current Assignee: Nanya Technology Corp.
- Current Assignee Address: TW Kueishan, Tao-Yuan Hsien
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A via structure includes at least a first via set and a second via set electrically connected to the first via set. There is at least one via in the first via set and at least one via in the second via set. The via in the first via set has a cross-sectional area which is larger than that of the via in the second via set.
Public/Granted literature
- US20130026647A1 VIA STRUCTURE Public/Granted day:2013-01-31
Information query
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