Invention Grant
- Patent Title: Method for producing a component and device having a component
- Patent Title (中): 用于制造具有部件的部件和装置的方法
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Application No.: US11770836Application Date: 2007-06-29
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Publication No.: US08482135B2Publication Date: 2013-07-09
- Inventor: Horst Theuss , Albert Auburger , Jochen Dangelmaier , Josef Hirtreiter
- Applicant: Horst Theuss , Albert Auburger , Jochen Dangelmaier , Josef Hirtreiter
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102006030581 20060703
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit.
Public/Granted literature
- US20080036099A1 Method for producing a component and device having a component Public/Granted day:2008-02-14
Information query
IPC分类:
