Invention Grant
- Patent Title: Test substrate and method for measuring contact force
- Patent Title (中): 测试基板和测量接触力的方法
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Application No.: US12878158Application Date: 2010-09-09
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Publication No.: US08482183B2Publication Date: 2013-07-09
- Inventor: Li Ll , Zhilong Peng , Wei Wang
- Applicant: Li Ll , Zhilong Peng , Wei Wang
- Applicant Address: CN Beijing
- Assignee: Beijing BOE Optoelectronics Technology Co., Ltd.
- Current Assignee: Beijing BOE Optoelectronics Technology Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN200910092941 20090911
- Main IPC: H01L41/08
- IPC: H01L41/08

Abstract:
A test substrate for measuring contact force and a method for measuring contact force are provided in the technology. The substrate may comprises: a base substrate, and a piezoelectric element provided on a surface of the base substrate. One end of the piezoelectric portion is a detecting voltage input terminal and the other end thereof is a detecting voltage output terminal. According to the technology, the substrate and method for measuring contact force can be used to measure the contact force applied to the substrate by the cleaning apparatus or conveying apparatus, and thus the contact force can be properly controlled and the adverse influence on the substrate from the conveying apparatus or cleaning apparatus can be decreased or eliminated.
Public/Granted literature
- US20110062822A1 TEST SUBSTRATE AND METHOD FOR MEASURING CONTACT FORCE Public/Granted day:2011-03-17
Information query
IPC分类: